|
Orderable Part Number |
Antenna Options |
On-Board SPI Flash (Mbit) |
Operating Temperature |
|
BDE-SG1312R7U32 |
U.FL Connector |
32 |
-40 °C to +85 °C |
|
BDE-SG1312R7N32 |
ANT Pin |
||
|
BDE-SG1312R7U0 |
U.FL Connector |
0 |
|
|
BDE-SG1312R7N0 |
ANT Pin |
||
|
BDE-SG1312R7U32-IN |
U.FL Connector |
32 |
-40 °C to +105 °C |
|
BDE-SG1312R7N32-IN |
ANT Pin |
||
|
BDE-SG1312R7U0-IN |
U.FL Connector |
0 |
|
|
BDE-SG1312R7N0-IN |
ANT Pin |
|
芯片组 |
CC1312R74T0RGZR |
|
协议 |
Sub-1G |
|
天线类型 |
Antenna Not Included |
|
频率 |
Sub-1G |
|
发射功率 |
14dBm |
|
敏感度 |
–120 dBm for 2.5 kbps long-range mode |
|
类型 |
- |
|
内存(MB) |
256K |
|
外设 |
I2C |
|
工作温度 |
-40°C to +105°C or -40°C to +105°C |
|
包装尺寸 |
22 mm x 15 mm x 2.15 mm |
|
闪存 |
8K |
|
中央处理器 |
CC1311R31T0RGZR |
|
系列状态 |
ACTIVE |
The BDE-SG1312R7 is a multiprotocol Sub-1GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC1312R74T0RGZR. In order to fulfil different integration scenarios, BDE provides different variants for this module series. They are listed and described in Table 1.
The BDE-SG1312R7 module series is embeded with an powerful 48-MHz Arm® Cortex®-M4F processor which supports IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, proprietary systems including TI 15.4-Stack (Sub-1GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The module series is optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
类型 |
标题 |
时间 |
|---|---|---|
数据手册 |
2026-03-11 |
