The BDE-SG1311R3-MODULES are low power, multiprotocol Sub-1 GHz wireless modules based on CC1311R3, supporting a range of protocols including IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, mioty, proprietary systems, and TI 15.4-Stack (Sub-1 GHz). These modules are embedded with a Powerful 48-MHz Arm Cortex-M4 processor, 352KB flash memory, and 32KB SRAM. The module delivers best-in-class RF performance with a transmit power of up to +14 dBm and a receive sensitivity of up to -121 dBm. Multiple variants are available to suit different integration needs, offering three antenna options: an ANT pin for an external antenna, a U.FL connector for an external antenna. Additionally, variants with embedded 32 Mbit SPI flash memory are available for extra storage requirements.
|
Part Number |
Size (mm) |
Core Chip |
Shipping Form |
MOQ |
|
BDE-SG1311R3U0 |
22 × 15 × 2.15 |
CC1311R3 |
Tape & Reel |
1K |
|
BDE-SG1311R3U32 |
22 × 15 × 2.15 |
CC1311R3 |
Tape & Reel |
1K |
|
BDE-SG1311R3N0 |
22 × 15 × 2.15 |
CC1311R3 |
Tape & Reel |
1K |
|
BDE-SG1311R3N32 |
22 × 15 × 2.15 |
CC1311R3 |
Tape & Reel |
1K |
| BDE-SG1311R3xx name convention(N – No antenna, U - U.FL connector, 0 - no flash, 32 - 32M flash) | ||||
|
Chipset |
CC1311R3 |
|
Protocols |
Sub-1G |
|
AntennaType |
Antenna Not Included |
|
Frequency |
868MHz |
|
TXPower |
14dBm |
|
Sensitivity |
-121.5dBm |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
I2C |
|
OperatingTemperature |
–40°C to +85°C |
|
PackageSize |
2.15mm ×15mm ×22mm |
|
FlashMemory |
352K |
|
CPU |
CC1311R3 |
|
SeriesStatus |
ACTIVE |
The BDE-SG1311R3 are multiprotocol Sub-1 GHz wireless module series that provide two options: BDE-SG1311R3U (U.FL connector version) and BDE-SG1311R3N (RF pad out version). These modules support IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, proprietary systems, and TI 15.4-Stack (Sub-1 GHz). The module is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
Type |
Title |
Time |
|---|---|---|
datasheet |
2024-05-29 |
