|
Orderable Part Number |
Antenna Options |
On-Board SPI Flash (Mbit) |
Operating Temperature |
|
BDE-SG1311P3N |
ANT pin |
32 |
-40 °C to +85 °C
|
|
Chipset |
CC1311P3 |
|
Protocols |
Sub-1G |
|
AntennaType |
Antenna Not Included |
|
Frequency |
Sub-1G |
|
TXPower |
14dBm |
|
Sensitivity |
–120 dBm for 2.5 kbps long-range mode |
|
Type |
- |
|
RAM(MB) |
256K |
|
Peripherals |
I2C |
|
OperatingTemperature |
-40°C to +105°C or -40°C to +105°C |
|
PackageSize |
22 mm x 15 mm x 2.15 mm |
|
FlashMemory |
8K |
|
CPU |
CC1311R31T0RGZR |
|
SeriesStatus |
ACTIVE |
BDE-SG1311P3 is a multiprotocol Sub-1 GHz wireless module supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN®, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The module is based on an Arm® Cortex® M4 main processor and optimized for low-power wireless communication and advanced sensing in grid infrastructure, building automation, retail automation, personal electronics and medical applications.
Type |
Title |
Time |
|---|---|---|
User Guide |
2026-03-11 |
|
Datasheet |
2026-03-11 |
