|
Orderable Part Number |
Antenna |
On-board SPI Flash |
Operating Temperature |
|
|
BDE-RFM208 |
U.FL Connector |
352K |
-40℃ to +85℃ |
|
|
BDE-RFM208P-S1 |
||||
|
BDE-RFM208P-2.4 |
||||
|
BDE-RFM208-IN |
-40℃ to +105℃ |
|||
|
Chipset |
CC1352R/P |
|
Protocols |
Sub-1G |
|
AntennaType |
U.FL Connector |
|
Frequency |
Sub-1G |
|
TXPower |
20dBm |
|
Sensitivity |
-121dBm |
|
Type |
Wireless module |
|
RAM(MB) |
80K |
|
Peripherals |
I2C |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
29.86 mm x 19.97 mm x 2.15 mm (With Shielding) |
|
FlashMemory |
352K |
|
CPU |
CC1352R/P |
|
SeriesStatus |
ACTIVE |
BDE-RFM208X is a multi-band wireless module series which supports Sub-1G and 2.4G band. It also supports multiprotocol, such as Thread, Zigbee, Bluetooth 5.0 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), Wireless M-Bus, Wi-SUN, KNX RF, proprietary systems, SimpleLink TI 15.4-Stack (Sub-1 GHz), and Dynamic Multiprotocol Manager (DMM) driver.
BDE-RFM208X highly integrates radio, stack, profile and applications in a SoC, without the need of using an external MCU. The module also offers flexible hardware interfaces for the sensor application.
It enables ultra-low power connectivity and data transfer for the applications that are sensitive to power consumption, size and cost.
Type |
Title |
Time |
|---|---|---|
Datasheet |
2026-01-19 |
|
Datasheet |
2026-01-19 |
|
Datasheet |
2026-01-19 |
|
Datasheet |
2026-01-19 |
