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BDE-MP2674R10XX

ACTIVE

Multi-Protocol Based on CC2674R10

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Product Details

Part Number

Antenna Type

Integrated On-board SPI Flash (Mbit)

Operating Temperature

BDE-MP2674R10A32

PCB trace antenna

32

-40 to +85

BDE-MP2674R10U32

U.FL connector

BDE-MP2674R10N32

ANT pin

BDE-MP2674R10A0

PCB trace antenna

0

BDE-MP2674R10U0

U.FL connector

BDE-MP2674R10N0

ANT pin

BDE-MP2674R10A32-IN

PCB trace antenna

32

-40 to +105

BDE-MP2674R10U32-IN

U.FL connector

BDE-MP2674R10N32-IN

ANT pin

BDE-MP2674R10A0-IN

PCB trace antenna

0

BDE-MP2674R10U0-IN

U.FL connector

BDE-MP2674R10N0-IN

ANT pin

Chipset

CC2674R10

Protocols

2.4G

AntennaType

Antenna Not Included
U.FL Connector
PCB Trace Antenna

Frequency

2.4G

TXPower

5dBm

Sensitivity

-105dBm

Type

Wireless module

RAM(MB)

256K

Peripherals

I2C
SPI
UART
I2S

OperatingTemperature

-40°C to +85°C
-40°C to +105°C

PackageSize

21.5 mm x 15 mm x 2.15 mm

FlashMemory

1024K

CPU

CC2674R10

SeriesStatus

ACTIVE

BDE-MP2674R10 is a high performance multiprotocol 2.4-GHz wireless module series based on Texas Instrument (TI)’s multiprotocol wireless microcontroller (MCU) CC2674R106T0RGZ. In order to fulfil different integration scenarios, we provide different variants for this module series. They are listed and described in Table 1.

 

BDE-MP2674R10 module series integrates an powerful 48-MHz Arm® Cortex®-M33 MCU and a dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards. It supports Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), proprietary systems including TI 15.4-Stack (2.4-GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets.

 

BDE-MP2674R10 module series can support +5 dBm output power and a receive sensitivity of -104 dBm for 125-kbps Bluetooth® Low Energy Coded PHY. It is with low standby current of 0.92 μA with full 256 KB RAM retention that enables longer battery life wireless applications. The module series supports for ARM® TrustZone® based secure key storage, device ID and trusted functions; Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. The device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current.

 

BDE-MP2674R10 module series integrates all required system-level hardware components including clocks, balun filter, other passives, and PCB trace antenna or U.FL connector into a small PCB form factor. It is for easy assembly and low-cost PCB design. It can work standalone with integrated powerful Arm® Cortex®-M33 for a wide range of applications without the need of external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-MP2674R10 module series is the best choice for the applications that are sensitive to power consumption, size and cost.

Document

Type

Title

Time

User Guide

BDE-MP2674R10_User_Guide_V1.0.pdf

2026-03-10

Datasheet

BDE-MP2674R10_Datasheet_V1.0.pdf

2026-03-10

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