The BDE-MP2674P10-MODULES are high-performance multiprotocol 2.4-GHz wireless modules with PA based on the CC2674P10, supporting a range of protocols including Thread, Zigbee®, Matter, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), proprietary systems like TI 15.4-Stack (2.4-GHz), and concurrent multiprotocol operation through a Dynamic Multiprotocol Manager (DMM) driver. These modules are embedded with a powerful 48MHz Arm® Cortex-M33 processor with TrustZone, 1024 KB flash memory, and 296 KB SRAM. The module delivers best-in-class RF performance with a transmit power of up to +20 dBm using an internal high-power PA and a receive sensitivity of up to -103 dBm. Multiple variants are available to suit different integration needs, offering three antenna options: an ANT pin for an external antenna, a U.FL connector for an external antenna, and an integrated PCB trace antenna. Additionally, variants with embedded 32 Mbit SPI flash memory are available for extra storage requirements.
|
Part Number |
Size (mm) |
Core Chip |
Shipping Form |
MOQ |
|
BDE-MP2674P10A0 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
|
BDE-MP2674P10A32 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
|
BDE-MP2674P10U0 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
|
BDE-MP2674P10U32 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
|
BDE-MP2674P10N0 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
|
BDE-MP2674P10N32 |
26 × 19 × 2.15 |
CC2674P10 |
Tape & Reel |
1K |
| BDE-MP2674P10x name convention(N – No antenna, U - U.FL connector, A – PCB antenna, 0 - no flash, 32- 32M flash) | ||||
|
Chipset |
CC2674P10 |
|
Protocols |
2.4G |
|
AntennaType |
U.FL Connector |
|
Frequency |
2.4G |
|
TXPower |
20dBm |
|
Sensitivity |
-105dBm |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
I2C |
|
OperatingTemperature |
–40°C to +85°C |
|
PackageSize |
2.15mm ×19mm ×26mm |
|
FlashMemory |
1024K |
|
CPU |
CC2674P10 |
|
SeriesStatus |
ACTIVE |
These BDE-MP2674P10 are high performance multiprotocol 2.4-GHz wireless modules supporting Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), proprietary systems including TI 15.4-Stack (2.4-GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. These modules are optimized for low-power wireless communication and advanced sensing in buiding security systems, HVAC, medical, wired networking, portable electronics, and home theater & entertainment markets.
Type |
Title |
Time |
|---|---|---|
datasheet |
2024-05-30 |
