The BDE-MP2674P10 is a high-performance 2.4 GHz multi-protocol wireless module series with integrated PA, based on Texas Instruments’ (TI) single-chip wireless microcontroller (MCU) CC2674P106T0RGZR. To meet different integration requirements, BDE offers multiple variants of this module series, as listed and described in Table 1.

The BDE-MP2674P10 integrates an Arm® Cortex®-M33 MCU and a dedicated software-controlled radio controller (Arm® Cortex®-M0). This architecture supports multiple physical layers and RF standards, including Thread, Zigbee®, Matter, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), proprietary systems, and TI 15.4-Stack (2.4 GHz). Concurrent multiprotocol operation is enabled through TI’s Dynamic Multiprotocol Manager (DMM) driver. The module features 1024 KB flash, 256 KB SRAM, and 8 KB cache SRAM.

The BDE-MP2674P10 has an ultra-low sleep current of 0.92 μA with RTC and 256 KB RAM retention, enabling long battery life for wireless applications. In addition to the main Cortex®-M33 processor, it includes an autonomous ultra-low-power Sensor Controller CPU with fast wake-up capability. For example, the sensor controller can perform 1 Hz ADC sampling at 1 μA system current. The device offers low SER (Soft Error Rate) FIT (Failure-In-Time) for long operational lifetime, and always-on RAM parity minimizes corruption risk from potential radiation events.

The series integrates all required system-level components — including clocks, balun filter, passives, and a PCB trace antenna or U.FL connector — into a compact PCB form factor, ensuring easy assembly and low-cost PCB design.

Pre-certified with FCC, ISED, CE, and Bluetooth SIG, the BDE-MB2674P10 enables quick integration and fast time-to-market for customer products.