The BDE-MP2651P3 is a high-performance 2.4 GHz multi-protocol wireless module series with integrated PA that supports up to 20dBm TX power. It is based on Texas Instruments’ (TI) single-chip wireless microcontroller (MCU) CC2651P31T0RGZR. To meet different integration requirements, BDE offers multiple variants of this module series, as listed and described in Table 1.

The BDE-MP2651P3 integrates a powerful 48-MHz Arm® Cortex®-M4 processor and a dedicated software-controlled radio controller (Arm® Cortex®-M0). This architecture supports multiple physical layers and RF standards, including Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, proprietary systems, and TI 15.4-Stack (2.4 GHz). Concurrent multiprotocol operation is enabled through TI’s Dynamic Multiprotocol Manager (DMM) driver. The module features 352 KB flash, 32 KB SRAM, and 8 KB cache SRAM.

The BDE-MP2651P3 has an ultra-low sleep current of 0.8 μA with RTC and 32 KB RAM retention, enabling long battery life for wireless applications.

The series integrates all required system-level components — including clocks, balun filter, passives, and a PCB trace antenna or U.FL connector — into a compact PCB form factor, ensuring easy assembly and low-cost PCB design.

Pre-certified with FCC, ISED, CE, and Bluetooth SIG, the BDE-MP2652P7 enables quick integration and fast time-to-market for customer products.