|
Series Name |
Orderable Part Number |
Antenna on Sub-1G |
Antenna on 2.4G |
On-board SPI Nor Flash (Mbit) |
Operating Temperature |
|
BDE-MB13R |
BDE-MB1354R10UA32 |
U.FL Connector |
PCB Trace Antenna |
32 |
-40℃ to +85℃ |
|
BDE-MB1354R10NA32 |
ANT Pin |
PCB Trace Antenna |
|||
|
BDE-MB1354R10UU32 |
U.FL Connector |
U.FL Connector |
|||
|
BDE-MB1354R10NU32 |
ANT Pin |
U.FL Connector |
|||
|
BDE-MB1354R10UN32 |
U.FL Connector |
ANT Pin |
|||
|
BDE-MB1354R10NN32 |
ANT Pin |
ANT Pin |
|||
|
BDE-MB1354R10UA0 |
U.FL Connector |
PCB Trace Antenna |
0 |
||
|
BDE-MB1354R10NA0 |
ANT Pin |
PCB Trace Antenna |
|||
|
BDE-MB1354R10UU0 |
U.FL Connector |
U.FL Connector |
|||
|
BDE-MB1354R10NU0 |
ANT Pin |
U.FL Connector |
|||
|
BDE-MB1354R10UN0 |
U.FL Connector |
ANT Pin |
|||
|
BDE-MB1354R10NN0 |
ANT Pin |
ANT Pin |
|||
|
BDE-MB1354R10UA32-IN |
U.FL Connector |
PCB Trace Antenna |
32 |
-40℃ to +105℃ |
|
|
BDE-MB1354R10NA32-IN |
ANT Pin |
PCB Trace Antenna |
|||
|
BDE-MB1354R10UU32-IN |
U.FL Connector |
U.FL Connector |
|||
|
BDE-MB1354R10NU32-IN |
ANT Pin |
U.FL Connector |
|||
|
BDE-MB1354R10UN32-IN |
U.FL Connector |
ANT Pin |
|||
|
BDE-MB1354R10NN32-IN |
ANT Pin |
ANT Pin |
|||
|
BDE-MB1354R10UA0-IN |
U.FL Connector |
PCB Trace Antenna |
0 |
||
|
BDE-MB1354R10NA0-IN |
ANT Pin |
PCB Trace Antenna |
|||
|
BDE-MB1354R10UU0-IN |
U.FL Connector |
U.FL Connector |
|||
|
BDE-MB1354R10NU0-IN |
ANT Pin |
U.FL Connector |
|||
|
BDE-MB1354R10UN0-IN |
U.FL Connector |
ANT Pin |
|||
|
BDE-MB1354R10NN0-IN |
ANT Pin |
ANT Pin |
|
Chipset |
CC1354R10 |
|
Protocols |
2.4G |
|
AntennaType |
Antenna Not Included |
|
Frequency |
Sub1G |
|
TXPower |
14dBm |
|
Sensitivity |
-121dBm |
|
Type |
Wireless module |
|
RAM(MB) |
256K |
|
Peripherals |
I2C |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
LCC-42, 26 mm x 19 mm x 2.15 mm |
|
FlashMemory |
1024K |
|
CPU |
CC1354R10 |
|
SeriesStatus |
ACTIVE |
The BDE-MB1354R10 is a multiprotocol and multi-band Sub-1GHz and 2.4GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC1354R106T0RGZ. In order to fulfil different integration scenarios, BDE provides different variants for this module series. They are listed and described in
The BDE-MB1354R10 module series is embeded with an powerful 48-MHz Arm® Cortex®-M33 processor with TrustZone® based secure key storage, device ID and trusted functions, and it supports Thread, Zigbee®, Bluetooth® 5.2 low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems including TI 15.4-Stack (Sub-1GHz and 2.4GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The module series is optimized for low-power wireless communication and advanced security features in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment markets and connected peripherals markets.
The BDE-MB1354R10 has a low standby current of 0.83 μA with full 256kB RAM retention, which enables longer battery life wireless applications. The module supports +14 dBm output power with best-in-class transmit current consumption at 25.8 mA for 868-MHz operation. This is suitable for the long-range and low-power applications. It is featured with the Low SER (Soft Error Rate) FIT (Failure-in-time) for long operational lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events. The device also has an autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1-μA system current.
The module series has a software defined radio powered by an Arm® Cortex® M0 which allows support for multiple physical layers and RF standards. PHY and frequency switching can be done runtime through a dynamic multiprotocol manager (DMM) driver.
The module series integrates all required system-level hardware components including clocks, balun filter, other passives, and PCB trace antenna or U.FL connector into a small PCB form factor. It is for easy assembly and low-cost PCB design.
The module is pre-certified with FCC, ISED, CE and Bluetooth SIG to make easy integration and fast time-to-market for customers.
Type |
Title |
Time |
|---|---|---|
Datasheet |
2026-03-10 |