The BDE-MB1352P72 is a multi-band (Sub-1 GHz and 2.4 GHz), multi-protocol wireless module series with an integrated PA in the 2.4 GHz band, based on Texas Instruments’ (TI) single-chip wireless microcontroller (MCU) CC1352P74T0RGZR. To meet different integration requirements, BDE offers multiple variants of this module series, as listed and described in Table 1.

The BDE-MB1352P72 integrates an Arm® Cortex®-M4F MCU and a dedicated software-controlled radio controller (Arm® Cortex®-M0). This architecture supports multiple physical layers and RF standards, including Thread, Zigbee®, Bluetooth® 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), mioty, Wi-SUN, Amazon Sidewalk, proprietary systems, and TI 15.4-Stack for both Sub-1 GHz and 2.4 GHz bands. Concurrent multiprotocol operation is enabled through TI’s Dynamic Multiprotocol Manager (DMM) driver. The module features 704 KB flash, 144 KB SRAM, and 8 KB cache SRAM.

The module supports operation in the 861 – 1054 MHz and 2360 – 2500 MHz frequency bands, with up to +14 dBm TX power in the Sub-1 GHz band and +20 dBm TX power in the 2.4 GHz band.

The BDE-MB1352P72 has an ultra-low sleep current of 0.9 μA with RTC and 144 KB RAM retention, enabling long battery life for wireless applications. In addition to the main Cortex®-M4F processor, it includes an autonomous ultra-low-power Sensor Controller CPU with fast wake-up capability. For example, the sensor controller can perform 1 Hz ADC sampling at 1 μA system current. The device offers low SER (Soft Error Rate) FIT (Failure-In-Time) for long operational lifetime, and always-on RAM parity minimizes corruption risk from potential radiation events.

Optimized for low-power wireless communication and advanced sensing, the module is well-suited for grid infrastructure, building automation, retail automation, personal electronics, and medical applications.

The series integrates all required system-level components — including clocks, balun filter, passives, and a PCB trace antenna or U.FL connector — into a compact PCB form factor, ensuring easy assembly and low-cost PCB design.

Pre-certified with FCC, ISED, CE, and Bluetooth SIG, the BDE-MB1352P72 enables quick integration and fast time-to-market for customer products.