|
Model Number |
Orderable Part Number |
Chipset |
Flash (KB) |
SRAM (KB) |
Antenna on 2.4G |
On-Board SPI Flash Support |
Operating Temperature |
|
BDE-LE2340R52KPA32 |
CC2340R52E0RKPR |
512 |
36 |
PCB Trace Antenna |
32Mbit |
-40℃ to +85℃ |
|
|
BDE-LE2340R52KPU32 |
U.FL Connector |
||||||
|
BDE-LE2340R52KPN32 |
ANT Pin |
||||||
|
BDE-LE2340R52KPA0 |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R52KPU0 |
U.FL Connector |
||||||
|
BDE-LE2340R52KPN0 |
ANT Pin |
||||||
|
BDE-LE2340R52KPA32-IN |
PCB Trace Antenna |
32Mbit |
-40℃ to +105℃ |
||||
|
BDE-LE2340R52KPU32-IN |
U.FL Connector |
||||||
|
BDE-LE2340R52KPN32-IN |
ANT Pin |
||||||
|
BDE-LE2340R52KPA0-IN |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R52KPU0-IN |
U.FL Connector |
||||||
|
BDE-LE2340R52KPN0-IN |
ANT Pin |
||||||
|
BDE-LE2340R53KPA32 |
CC2340R53E0RKPR |
512 |
64 |
PCB Trace Antenna |
32Mbit |
-40℃ to +85℃ |
|
|
BDE-LE2340R53KPU32 |
U.FL Connector |
||||||
|
BDE-LE2340R53KPN32 |
ANT Pin |
||||||
|
BDE-LE2340R53KPA0 |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R53KPU0 |
U.FL Connector |
||||||
|
BDE-LE2340R53KPN0 |
ANT Pin |
||||||
|
BDE-LE2340R53KPA32-IN |
PCB Trace Antenna |
32Mbit |
-40℃ to +105℃ |
||||
|
BDE-LE2340R53KPU32-IN |
U.FL Connector |
||||||
|
BDE-LE2340R53KPN32-IN |
ANT Pin |
||||||
|
BDE-LE2340R53KPA0-IN |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R53KPU0-IN |
U.FL Connector |
||||||
|
BDE-LE2340R53KPN0-IN |
ANT Pin |
||||||
|
BDE-LE2340R22KPA32 |
256 |
36 |
PCB Trace Antenna |
32Mbit |
-40℃ to +85℃ |
||
|
BDE-LE2340R22KPU32 |
U.FL Connector |
||||||
|
BDE-LE2340R22KPN32 |
ANT Pin |
||||||
|
BDE-LE2340R22KPA0 |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R22KPU0 |
U.FL Connector |
||||||
|
BDE-LE2340R22KPN0 |
ANT Pin |
||||||
|
BDE-LE2340R22KPA32-IN |
PCB Trace Antenna |
32Mbit |
-40℃ to +105℃ |
||||
|
BDE-LE2340R22KPU32-IN |
U.FL Connector |
||||||
|
BDE-LE2340R22KPN32-IN |
ANT Pin |
||||||
|
BDE-LE2340R22KPA0-IN |
PCB Trace Antenna |
Not Included |
|||||
|
BDE-LE2340R22KPU0-IN |
U.FL Connector |
||||||
|
BDE-LE2340R22KPN0-IN |
ANT Pin |
|
Chipset |
CC2340R |
|
Protocols |
2.4G |
|
AntennaType |
integrated PCB antenna |
|
Frequency |
2.4G |
|
TXPower |
8dBm |
|
Sensitivity |
-98dBm |
|
Type |
Wireless module |
|
RAM(MB) |
36k |
|
Peripherals |
I2C |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
11.5 mm x 13.5 mm x 2.0 |
|
FlashMemory |
256K |
|
CPU |
CC2340R |
|
SeriesStatus |
ACTIVE |
BDE-LE2340R22KP is a Bluetooth® 5.3 Low Energy and Proprietary 2.4-GHz wireless module series based on Texas Instrument (TI)’s single-chip wireless microcontroller (MCU) CC2340R22E0RKPR. In order to fulfil different integration scenarios, we provide different variants for this module series.
BDE-LE2340R22KP module series integrates an Arm® Cortex®-M0+ MCU, which supports Bluetooth® 5.3 Low Energy, ZigBee®, SimpleLink™ TI 15.4-stack and Proprietary systems. This device is optimized for low-power wireless communication with on-chip dual image Over the Air Download (OAD) support in building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf label), and personal electronics (toys, HID, stylus pens) markets.
BDE-LE2340R22KP module series can support up to +8 dBm output power and a receive sensitivity of -102 dBm for 125 kbps Bluetooth® Low Energy Coded PHY. It is with ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables significant battery life extension especially for applications with longer sleep intervals. The module series supports for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.
BDE-LE2340R22KP module series highly integrates the radio with required passives, high-frequency clock, low-frequency clock, filter, antenna, ect., and also a fully-qualified Bluetooth® 5.3 software protocol stack and profiles from TI. It can work standalone without using an external MCU. With its best-in-class radio performance, ultra-low power, small form factor and low cost, the BDE-LE2340R22KP module series is the best choice for the applications that are sensitive to power consumption, size and cost.
Type |
Title |
Time |
|---|---|---|
Datasheet |
2026-03-10 |