BDE-BW3351xP2 are 2.4-GHz and 5-GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Combo wireless modules based on TI’s 10th generation connectivity combo chip CC3351 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3351xP2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded devices applications with a small PCB footprint and highly optimized bill of materials with lower cost.
|
Orderable Part Number |
Connectivity |
Antenna Options |
Antenna Diversity Support |
Operating Temperature |
|
BDE-BW3351NP2 |
Wi-Fi 6 2.4-GHz 5-GHz & BLE 5.2 |
No antenna |
Supported |
-40 °C to +85 °C |
|
BDE-BW3351UP2 |
Wi-Fi 6 2.4-GHz 5-GHz & BLE 5.2 |
U.FL connector |
Supported |
-40 °C to +85 °C |
| BDE-BW3351xP2 name convention(N – No antenna, U - U.FL connector, A – PCB antenna, 1 - single antenna, 2- dual antenna with antenna diversity, IN – extend Industrial grade supports -40°C ~ 105°C.) | ||||
|
Chipset |
CC3351 |
|
Protocols |
Bluetooth |
|
AntennaType |
Antenna Not Included |
|
Frequency |
2.4G |
|
TXPower |
20dBm |
|
Sensitivity |
- |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
22 mm x 30 mm x 2.8 mm |
|
FlashMemory |
- |
|
CPU |
CC3351 |
|
SeriesStatus |
ACTIVE |
BDE-BW3351xP2 is a 2.4-GHz and 5-GHz Dual-Band Wi-Fi 6 and Bluetooth Low Energy Combo wireless module based on TI’s 10th generation connectivity combo chip CC3351 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3351xP2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.
Type |
Title |
Time |
|---|---|---|
Data sheet |
2024-10-12 |
