BDE-BW3350x1 are 2.4-G/5GHz Wi-Fi 6 wireless module based on TI’s 10th generation connectivity companion chip CC3350 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3350x1 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.
| Orderable Part Number |
Connectivity |
Antenna Options |
Antenna Diversity Support |
Operating Temperature |
|
BDE-BW3350N1 |
Wi-Fi 6 2.4-G/5GHz SISO |
ANT pin |
Not supported |
-40 °C to +105 °C |
|
BDE-BW3350U1 |
Wi-Fi 6 2.4-G/5GHz SISO |
U.FL connector |
Not supported |
-40 °C to +105 °C |
|
BDE-BW3350A1 |
Wi-Fi 6 2.4-G/5GHz SISO |
PCB trace antenna |
Not supported |
-40 °C to +105 °C |
| BDE-BW3350x1 name convention(N – No antenna, U - U.FL connector, A – PCB antenna, 1 - single antenna, 2- dual antenna with antenna diversity) | ||||
|
Chipset |
CC3350 |
|
Protocols |
WiFi |
|
AntennaType |
Antenna Not Included,
U.FL Connector,
PCB Trace Antenna |
|
Frequency |
2.4G |
|
TXPower |
20dBm |
|
Sensitivity |
- |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
Host controller interface (HCI) transport with option for shared SDIO or UART |
|
OperatingTemperature |
-40°C to +105°C |
|
PackageSize |
65-QFM, 11-mm x 11-mm x 2-mm |
|
FlashMemory |
- |
|
CPU |
CC3350 |
|
SeriesStatus |
ACTIVE |
BDE-BW3350x1 are 2.4-G/5GHz Wi-Fi 6 wireless modules based on TI’s 10th generation connectivity companion chip CC3350 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW335XX could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.In order to fulfil different integration requirements, BDE provides different options including: BDE-BW3301N1, single antenna port without antenna; BDE-BW3301U1, single antenna port with U.FL connector; BDE-BW3301A1, single antenna with integrated PCB trace antenna.
Type |
Title |
Time |
|---|---|---|
Data sheet |
2024-10-12 |
