BDE-BW3301x1 are 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless module based on TI’s 10th generation connectivity companion chip CC3301 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW330XX could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.
|
Orderable Part Number |
Connectivity |
Antenna Options |
Antenna Diversity Support |
Operating Temperature |
|
BDE-BW3301N1 |
Wi-Fi 6 2.4-GHz SISO & BLE 5.4 |
ANT pin |
Not supported |
-40 °C to +85 °C |
|
BDE-BW3301U1 |
Wi-Fi 6 2.4-GHz SISO & BLE 5.4 |
U.FL connector |
Not supported |
-40 °C to +85 °C |
|
BDE-BW3301A1 |
Wi-Fi 6 2.4-GHz SISO & BLE 5.4 |
Ceramic chip antenna |
Not supported |
-40 °C to +85 °C |
| BDE-BW3301x1 name convention(N – No antenna, U - U.FL connector, A – PCB antenna, 1 - single antenna, 2- dual antenna with antenna diversity) | ||||
|
Chipset |
CC3301 |
|
Protocols |
Bluetooth,
WiFi |
|
AntennaType |
Antenna Not Included,
U.FL Connector,
PCB Trace Antena |
|
Frequency |
2.4G |
|
TXPower |
20dBm |
|
Sensitivity |
- |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
65-QFM, 11-mm x 11-mm x 2-mm |
|
FlashMemory |
- |
|
CPU |
CC301 |
|
SeriesStatus |
ACTIVE |
BDE-BW3301x1 are 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless modules based on TI’s 10th generation connectivity companion chip CC3301 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW330XX could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.In order to fulfil different integration requirements, BDE provides different options including: BDE-BW3301N1, single antenna port without antenna; BDE-BW3301U1, single antenna port with U.FL connector; BDE-BW3301A1, single antenna with integrated PCB trace antenna.
Type |
Title |
Time |
|---|---|---|
Data sheet |
2024-10-12 |
