BDE-BW3301NPxM2 are 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3301 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3301NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.
|
Orderable Part Number |
Connectivity |
Antenna Options |
Antenna Diversity Support |
Operating Temperature |
|
BDE-BW3301NP1M2 |
Wi-Fi 6 2.4-GHz SISO & BLE 5.2 |
U.FL connector |
Not supported |
-40 °C to +85 °C |
|
BDE-BW3301NP2M2 |
Wi-Fi 6 2.4-GHz SISO & BLE 5.2 |
U.FL connector |
Supported |
-40 °C to +85 °C |
| BDE-BW3301NxM2 name convention(1 - single antenna, 2- dual antenna with antenna diversity) | ||||
|
Chipset |
CC3301 |
|
Protocols |
Bluetooth |
|
AntennaType |
U.FL Connector |
|
Frequency |
2.4G |
|
TXPower |
20dBm |
|
Sensitivity |
- |
|
Type |
Wireless module |
|
RAM(MB) |
- |
|
Peripherals |
Host controller interface (HCI) transport for Bluetooth with option for shared SDIO or UART |
|
OperatingTemperature |
-40°C to +85°C |
|
PackageSize |
22 mm x 30 mm x 2.8 mm |
|
FlashMemory |
- |
|
CPU |
CC3301 |
|
SeriesStatus |
ACTIVE |
BDE-BW3301NPxM2 are 2.4-GHz Wi-Fi 6 and Bluetooth Low Energy Combo wireless M.2 card based on TI’s 10th generation connectivity combo chip CC3301 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio. These modules are ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3301NPxM2 could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost. The module integrates a BDE module (BDE-BW3301NP1 or BDE-BW3301NP2) on board, and provides a PCI Express M.2 interface to user, which is 2230 Key-E M.2 interface. It is designed for ease of use and integration to the embedded systems.
Type |
Title |
Time |
|---|---|---|
Data sheet |
2024-10-12 |
