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BDE-BW3300xP1

ACTIVE

Wi-Fi 6

BDE-BW3300xP1 are 2.4-GHz Wi-Fi 6 wireless modules based on TI’s 10th generation connectivity combo chip CC3300 which are based upon proven technology and complements the TI integrated devices for connectivity portfolio.

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Product Details

Orderable Part Number

Connectivity

Antenna Options

Antenna Diversity Support

Operating Temperature

BDE-BW3300NP1

Wi-Fi 6 2.4-GHz SISO

ANT pin

Not supported

-40 °C to +85 °C

BDE-BW3300UP1

Wi-Fi 6 2.4-GHz SISO

U.FL connector

Not supported

-40 °C to +85 °C

BDE-BW3300AP1

Wi-Fi 6 2.4-GHz SISO

PCB trace antenna

Not supported

-40 °C to +85 °C

BDE-BW3300NP1-IN

Wi-Fi 6 2.4-GHz SISO

ANT pin

Not supported

-40 °C to +105 °C

BDE-BW3300UP1-IN

Wi-Fi 6 2.4-GHz SISO

U.FL connector

Not supported

-40 °C to +105 °C

BDE-BW3300AP1-IN

Wi-Fi 6 2.4-GHz SISO

PCB trace antenna

Not supported

-40 °C to +105 °C

BDE-BW3300xP1 name convention(N – No antenna, U - U.FL connector, A – PCB antenna, 1 -  single antenna, 2- dual antenna with antenna diversity, IN – extend Industrial grade supports -40°C ~ 105°C.)

Chipset

CC3300

Protocols

WiFi

AntennaType

Antenna Not Included
U.FL Connector
PCB Trace Antena

Frequency

2.4G

TXPower

20dBm

Sensitivity

+15dBm

Type

Wireless module

RAM(MB)

-

Peripherals

4-bit SDIO and SPI host interfaces

OperatingTemperature

-40°C to +85°C

PackageSize

64-QFM, 13.4-mm x 13.3-mm x 2-mm (BDE-BW3300NP1)
64-QFM, 18.4-mm x 13.3-mm x 2-mm (BDE-BW3300UP1, BDE-BW3300AP1)

FlashMemory

-

CPU

-

SeriesStatus

ACTIVE

BDE-BW3300xP1 are 2.4-GHz Wi-Fi 6 wireless module based on TI’s 10th generation connectivity combo chip CC3300 which is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This module is ideal for use in cost sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the peak throughput requirement is 50 Mbps maximum at the IP layer. BDE-BW3301xPx could be the best choice for bringing the efficiency of Wi-Fi 6 to embedded device applications with a small PCB footprint and highly optimized bill of materials with lower cost.

Document

Type

Title

Time

User guide

BDE-BW33xx_Module_User_Guide_V1.0.pdf

2024-12-02

Data sheet

BDE-BW3300xP1_Datasheet_V1.0.pdf

2024-10-12

Design & Development

  • WQFN

    Users can download and view it to learn more about the design of the product and help users use the module

    download
  • VFQN2

    Users can download and view it to learn more about the design of the product and help users use the module

    download
  • VFQN2

    Users can download and view it to learn more about the design of the product and help users use the module

    download
  • SIMPLELINK-WIFI-DESIGN-REVIEWS

    Hardware design reviews for SimpleLink™ Wi-Fi devices

    download
  • CC330x Reference Design Files

    download
  • SIMPLELINK-WIFI-TOOLBOX

    SimpleLink Wi-Fi Toolbox collection of tools to help development and testing of the CC33xx

    download
  • CC33XX-LINUX-AM335

    CC33xx device driver source for AM335x Sitara™ processor

    download
  • CC33XX-LINUX-AM62

    CC33xx device driver source for AM62x Sitara Processor

    download
  • CCSTUDIO

    Code Composer Studio™ integrated development environment (IDE)

    download

Ordering

Download permission application

FileName

Phone